White Industrial Ceramic Parts Heat Conduction And Heat Dissipation Insulat

Product Description
aln ceramic basic chip product heat conduction and heat dissipation insulation high
brightness LED

product name:aln ceramic basic chip

product description:

Aluminum nitride is one of the few materials with both good thermal conductivity
and good electrical insulation properties, and has the following advantages : ( 1 )
Aluminum nitride has high thermal conductivity. The theoretical thermal
conductivity at room temperature can reach 320W / ( m · K ), which is 8 ~ 10 times
that of alumina ceramics. The thermal conductivity of actual production can also be
as high as 200W / ( m · K ), which is conducive to heat dissipation in LEDs and
improves LED performance. ( 2 ) The linear expansion coefficient of AlN is small,
and the theoretical value is4.6 × 10-6 / K, which is similar to the thermal
expansion coefficient of Si and GaAs, and the change rule is similar to the thermal
expansion coefficient of Si. In addition, aluminum nitride matches the GaN lattice.
Thermal matching and lattice matching are conducive to the good combination of the
chip and the substrate during the preparation of high-power LED, which is the
guarantee of high-performance high-power LED. ( 3 ) The energy gap width of AlN
ceramics is 6.2eV, and the insulation is good. When applied to high-power LEDs, it
does not need insulation treatment, which simplifies the process. ( 4 ) Aluminum
nitride is wurtzite structure, combined with a strong covalent bond, so it has high
hardness and high strength, good mechanical properties. In addition, aluminum
nitride has good chemical stability and high temperature resistance. It can
maintain stability when the temperature reaches 1000 °C in air atmosphere, and has
good stability when the temperature reaches 1400 °C in vacuum, which is conducive
to sintering at high temperature, and the corrosion resistance can meet the
subsequent process requirements.



product performance index:

Performance content performance index
Thermal conductivity(W/m.k)
≥200
Volume resistivity (Ω.cm)
＞1013
Dielectric constant[1MHz,25℃]
9
Dielectric loss [1MHz,25℃]
3.8×10-4
Electrical strength (KV/mm)
17
Volume density(g/cm3)
≥3.30
The surface roughness Ra(μm)
0.3～0.5
Coefficient of thermal expansion
[20℃-300℃](10-6/℃)

4.6
The bending strength(MPa)
320～330
Elastic modulus (MPa)
310～320
Mohs hardness
8
Water absorption(%)
0
Warpage[～/25(length)]
0 , .03～0.05
Melting point
2500
Appearance / color grayish white
incanus

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