SMT rigid PCB Printed Circuit Boards 6 Layer 100 Ohm

Specifications:



1 All dimensions are in MM.

2 Fabricate per IPC-6012A Class2.

3 Materials:

3.1 Dielectric: FR4 Per IPC or equivalent

3.2 Min Tg: 170DEG

3.3 Copper: As per stack up

3.4 UL Rating: 94V0 Minimum

4 Surface finish: ENIG

5 Solder mask material should meet all requirement of the IPC-SM-840E and shall
be green in color and applied over bare copper. Vendor may edit solder mask and
paste mask as needed.

6 Editing of existing copper layers shall require customer approval.

7 Silkscreen legend to be applied per layer stackup using white non-
conductitive epoxy ink.

8 100% continuity testing using database netlist shall be performed.Vendor to
identify test passed in secondary side.

9 Vendor to mark date code and logo in legend secondary side.

10 Bow and twist shall not exceed 1.0% of longest side.

11 Vendor to provide panel drawing for customer approval before production





PCB report have to include the following information:



1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole
size dimension, copper thickness, hole wall copper thickness, solder mask
thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result,
visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.

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