Insulation, Accessories & Others

Some customers gave us a master data sheet from other suppliers for comparing when they wanted to select a thermal gap pad from GLPOLY, all requirements should be similar. For example, the original data sheet marked”fiberglass or PI reinforced”, they need a fiberglass reinforced material too, even they don’t know what function or effect it acts. Firstly, the fiberglass or PI will increase thermal resistance. Both of them will not act as thermal interface materials, reducing thermal performance. Secondly, cost rise. If you need a same thermal conductivity after fiberglass or PI reinforced, we need to use a higher performance material, costs will rise by 30%. At the meantime, the cost of process will be inceased too, because it’s more sophisticated. Also don’t forget the cost of fiberglass or PI. Last week, one solar equipment manufacturer contacted me and ask if we can make a thermal gap pad meeting his requirements. Actually, it just was a regular product, 2.0W/mK of thermal conductivity, Shore00 50 hardness, 4.0mm thickness, one sided fiberglass reinforced. I asked the cutomer why he request fiberglass reinforcement because it affects heat transfer greatly. The custmer get this data sheet from another supplier, said “it increases tear resistance for easy assembly”. I understand customer’s concerns, but according to our experience, a thermal silicone pad with Shore00 50 hardness and 4.0mm thickness provides enough tensile strength and tear resistance for assembly. Finally, we sent samples without reinforcement to customer, and test went well. We will recommend a better solution for you and keeping your devices performing steady.

Minimum Order: 10 long tons

Thermal gel is becoming more and more popular in electronic device thermal management, and its share of market continues to rise. Comparing with thermal silicone grease, thermal gel provides advantages like easier assembly process, longer service life, higher automation level. Last June, An automotive electronics manufacturing customer consulted me about thermal interface materials and asking for a XK-G30 thermal gel with a thermal conductivity of 3.0W/mK for testing. two months later, customer told me that performance of thermal gel XK-G30 was excellent, they satisfied with product verification. This customer used to apply thermal silicone grease to automotive electronics such as driving recorder, the performance was good at the beginning or in the first half a year of service life, but it declined gradually in the next months till it failed. When customer took device apart, he found that thermal silicone grease dried out and failure to perform. GLPOLY thermal gel is designd to eliminate this concern, providing a 8-year service life. Now this customer had GLPOLY XK-G30 thermal gel applied to driving recorder and camera in volume production. GLPOLY thermal gel brings you values: 1.Low thermal resistance, optimize heat transfer 2.Design flexibility, high performance and non-dry out will allow you to focus your energy on product design 3.Decreases purchase complexity, one package suited a variety of dispense machines for automated dispense process There is no doubt that thermal gel will replace thermal silicone grease, improving thermal management of electronic devices. GLPOLY has collaborated with dJI, Huawei Marine, NIO Automotive etc, providing exceptional performance thermal interface materials for them to protect their brand reputation for reliability and performance.

Minimum Order: 10 long tons

Faster, smaller electronic devices put the wonderful world in users’ pocket, LED brighter lights, much powerful batteries, etc. What do these have in common? None of them would be possible without a effective thermal management solution. Heat is a unavoidable bypproduct of electronic device operation, but it can degrade performance even damage components if allowed to build inlocked. To help your designs keep them cool, GLPOLY has developed a complete portfolio of thermal management materials with proven ability to absorb and redirect heat away from critical parts. GLPOLY has entered into thermal management materials industry for 12 years, committed to becoming a leading enterprise and providing advanced thermal solution for customer. At Goldlink, developing high quality Thermal Interface Material and Thermal Solutions for electronics industry is our first priority. We serve a multitude of industries worldwide including automotive, computer, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion. We pride ourselves on rapid sampling, extensive product portfolio and top-class technical support. As a professional Thermal Interface Material manufacturer, we understand problems, we also know that there will always be a better way to help you achieve your goals and objectives. GLPOLY is focused on a single purpose---discovering the need, then developing and delivering the advanced thermal solutions with compele portfolio of thermal management materials.

Minimum Order: 10 long tons

The Benefits That Silicone-free Thermal Gel Brings to You More Than Applying To Silicone-sensitive Application As a thermal management materials supplier, we often received questions from customer. For example, What’s the difference between silicone and silicone-free based thermal materials? Which material provides better performance, thermal pad or liquid thermal materials? Do liquid thermal material and thermal gap provide same performance with the same thermal conductivity? Take GLPOLY XK-GN30 as an example to illustrate briefly. Silicone-free thermal interface materials has no silicone content, it is ideal for silicone-sensitive applications which has a optical window, such as camera, LED lights, Automotive headlights, avoiding siloxane volatiles and preventing them from atomizing. XK-GN30 is a high performance, thermally conductive, one-component packaged, liquid gap filling material with a thermal conductivity of 3.0W/mK. as we know, liquid thermal material has a low thermal impedance. With the same thermal conductivity, XK-GN30 silicone-free thermal gel has a thermal resistance of 0.01℃in2/W, comparing with a 3.0W/mK thermal gap pad, thermal impedance of XK-GN30 non-silicone thermal gel is one twentieth of that of thermal gap pad. GLPOLY XK-GN30 provides a ultra thin bondline thickness of 0.09mm, making heat transfer fast. Comparing with thermal gap pad, usually the thinnest thicnkess is 0.3mm. XK-GN30 is suitable for filling the intricate gaps and voids, it deflects under low compressive forces improving interface contact. Thermal gap pad never fill gaps as complete as liquid thermal material. GLPOLY XK-GN30 silicone-free thermal gel has been applied to industrial camera in volume production for 5 years, it provides high performance and reliability, helps keep your devices performing at their best and extending service life.

Minimum Order: 10 long tons

Hard to find an alternative to Laird Tflex 900 in local Chinese market in the past. It changed a lot in recent years. At least, GLPOLY is able to compete with top class brands such as Laird, Bergquist, Fujipoly or 3M. Many manufacturers said that their products are alternative to top class products as mentioned above, but if you test the objects, you can always find some probems, parameters mismatched. For instance, some manufacturers made the thermal conductivity of 8.0W/mK, which is as high as Laird Tflex900’s, but the hardness is beyond expectation, it is detrimental to heat transfer. GLPOLY can provide an excellent alternative to Laird Tflex900, no matter thermal properties or physical properties. Here is a case. One millimater wave radar manufacturer consulted with us about high performance thermal gap pad which is used for replacing Laird Tflex900. Some properties must be consistent with that of Laird Tflex900. We recommended GLPOLY XK-P80 thermal gap pad to customer. This thermal pad is a high thermal performance, electrical insulation and highly conformable gap filling material with a thermal conductivity of 8.0W/mK. I can imagine that customer will doubt the performance of this thermal gap pad, but test will exhibit detail. Test resulteds showed that both GLPOLY XK-P80 and Laird Tflex900 provided a thermal conductivity of 8.0W/mK, but XK-P80’s thermal imepdance 0.13℃in2/W which is much lower than Laird Tflex900’s. This really surprised customer, “This is only local product that meet our requirements I had tested.” GLPOLY has been providing thermal gap pad and thermal gap filler for some car manufacturers, help resolving problems of battery pack and ECU thermal management, such as NIO GAC etc. GLPOLY is able to provide complete portfolio of thermal management materials including thermal gap pad, two component thermal gap filler, one-part thermal gel, (thermal paste) and silicone-free thermal materials for you to protect your brand reputation for performance and reliability. GLPOLY has collaborated with top-class brands such as dJI, LG, Freetech Auto Pilot, NIO Auto etc., providing advanced technological thermal management solutions backing by superior service.

Minimum Order: 10 long tons

GLPOLY Non-silicone thermal gel helps solve thermal management challenge of AI chip detection equipment. GLPOLY is the leading company in developing non-silicone thermal interface materials in China, competing against international top brands. GLPOLY has launched a range of non-silicone thermal material while the peers was researching the materials. In recent years, some peers claimed that they developed performance non-silicone thermal interface materials. When we received inquiry from customer, we could receive grumble about the non-silicone thermal interface materials they bought before. A customer from chip manufacturing company in Hefei, he wanted to select a non-silicone thermal gel for improving thermal management of AI chip detection equipment. in the past several months they had tested six samples, and found that none of them could meet the requirements, either performance or physical properties. For example, in the second half of test, the temperature rise exceeded design requirements. When they took components apart, they found that the non-silicone thermal gel was dried out, leading to thermal runaway and component failures. As a professional non-silicone thermal gel manufacturer, we promised that a genuine non-silicone thermal gel would never dry out within the range of service temperature. I recommended customer test GLPOLY XK-GN30 non-silicone thermal gel. Three days later, customer received sample, then carried out high temperature aging test at 150 Celsius degree for 1000 hours. In the process of test, the temperature was always lower than he expected. Most importantly, XK-GN30 still remained paste state, performing at its best. GLPOLY XK-GN30 non-silicone thermal gel was the only one that could meet his design among the samples he had ever tested. GLPOLY non-silicone thermal gel XK-GN30 is a high performance, liquid gap filling material with excellent reliability. It deflects and fills intricate gap under low compressive forces, decreasing stress on component thus decreasing component failures. GLPOLY non-silicone thermal gel has been applied to amultitude of industries including camera, displayer, laser, high powered LED lighting, head light and more. GLPOLY has partnered with leading enterprises such as LG, DJI, ZTE, Huawei, DT Mible, Quectel, GAC Motor, NIO Motor and Freetech etc, providing them with advanced thermal interface materials and pioneering thermal management solution, helping keep their devices performing at their best and protect customer’s brand reputation.

Minimum Order: 10 long tons

5G brings high efficiency, at the meantime it requires more efficient thermal management solution due to great deal of heat that generated by huge amount of data exchange. GLPOLY has developed a non-curing, non-drip off high performance thermal gel / thermal putty XK-G70 to solve thermal management problems for 5G telecommunication equipment, beating competitive products in China. Heat transfer of 5G telecommunication equipment is a great challenge to thermal gap pad. Comparing with thermal gap filler pad, no matter the thermal resistance, bondline thickness and assembly process, thermal gel / thermal putty provides superior advantages in the limited package. Thermal gel / thermal putty tends to be one of the best thermal management solutions. GLPOLY XK-G70 thermal gel / thermal putty has following superiorities: 1.Thermal conductivity 7.0W/mK, ultra low thermal resistance, bondline thicnkness 0.15mm improve heat transfer; 2.Compatible with high volume, automated dispense process; 3.Aging test at 150 centigrade for 1200hrs; high and low temperature thermal shock for 500 cycles from-40 to 150 centigrade; GLPOLY has introduced automated production lines for XK-G70 thermal putty production to keep consistancy of product. GLPOLY thermal putty has been applied to automotive electronic control unit, drone and consumer electronics in volume production. GLPOLY thermal interface materials provide you with superior design flexibility.

Minimum Order: 10 long tons

GLPOLY Thermal Gap Pad XK-P80-PUTTY Is The Only One That Can Substitute For Fujipoly PG80A Maybe Fujipoly is one of the most famous thermal interface materials manufacturers worldwide, so many thermal management engineers have some reasons to select Fujipoly thermal materials, such as high performance, highly conformable or high reliability. Is it real that domestic products don’t work quite as well? I don’t think so. Taking Fujipoly products as benchmark, GLPOLY has been invested a lot of sources to develop high performance thermal management and made a lot of achievements also. For example, GLPOLY thermal gap pad XK-P80-PUTTY is a high performance gap filling material which provides similar performance to Fujipoly PG80A. One customer wanted to find a high performance thermal gap pad in local market which must be alternative to Fujipoly PG80A. The customer asked for samples from five domestic suppliers, none of them met the requirements. We learned that the biggest problem is hardness and compression. As everyone knew, the higher thermal conductivity, the harder the thermal pad, because we need to fill more thermally conductive powder into resin. The customer designed a 0.3mm gap which filled by a 1.5 mm thick thermal pad, that means a compression rate of 80% is needed. This is the biggest advantage of Fujipoly PG80A. We recommended XK-P80-PUTTY to customer and sent them a sample for testing. One day later, the customer fed back,”I was surpprised, your sample exhibited similar technical data to Fujipoly PG80A, thermal conductivity is 8.0W/mK and compression rate is up to 80%, it perfectly substitutes for PG80A, I will recommend your product to our team.” GLPOLY thermal gap pad XK-P80-PUTTY is high thermal performance, high compression gap filling pad. This material features high thermal conductivity and low thermal impedance, providing effective heat transfer from heat source to heatsink and helps keep your devices cool and performing at their best.

Minimum Order: 10 long tons

Thermal gel is an ideal thermal solution for fragile chip in assembly, replacing Chomerics THERM-A-GAP GEL30. We used to apply thermal gap pad in thermal management, sometimes, there would be some problems. If a certain amount of compression is required, the compressive force may destroy the chip. How can we fix this problem? Here is a example for your reference. A medical equipment consulted with us about thermal management solution. they used a thermal gap pad with a thermal conductivity of 3.6W/mK, the performance is good enough when they tested the thermal pad, but heat dissipating is not as good as expected. The supplier told them the interface contact is not tight enough, and requested customer to place much more compressive forces. Finally, this resulted in destroy to chip. As we learned about this application, we knew the strain was what it mattered. GLPOLY had designed a sort of thermal gel to fix problem like this. We recommended XK-G40 high performance thermal gel with a thermal conductivity of 4.0W/mK which was verified by third party to customer. This material deflects under low compressive force, decreasing stress on component thus decreasing components failure. GLPOLY XK-G40 is high performance, thermally conductive, liquid gap filling material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer purchasing complexity. This material is one-component packaged, suitable for automated dispensing system, improving productivity. It provides similar performance to Chomerics THERM-A-GAP GEL30. GLPOLY thermal management materials had been applied to military equipment, automotive electroncis and EV battery pack and ECU. GLPOLY helps keep your devices performing stable with complete portfolio of thermal interface materials including thermal gap, thermal gap filler, thermal paste and silicone-free thermal materials.

Minimum Order: 10 long tons

GLPOLY Thermal Gap Pad XK-P60 Is The Only One That Can Substitute For Fujipoly GR45A Maybe Fujipoly is one of the most famous thermal interface materials manufacturers worldwide, so many thermal management engineers have some reasons to select Fujipoly thermal materials, such as high performance, highly conformable or high reliability. Is it real that domestic products don’t work quite as well? I don’t think so. Taking Fujipoly products as benchmark, GLPOLY has been invested a lot of sources to develop high performance thermal management and made a lot of achievements also. For example, GLPOLY thermal gap pad XK-P60 is a high performance gap filling material which provides similar performance to Fujipoly GR45A. One customer wanted to find a high performance thermal gap pad in local market which must be alternative to Fujipoly GR45A. The customer asked for samples from five domestic suppliers, none of them met the requirements. We learned that the biggest problem is hardness and compression. As everyone knew, the higher thermal conductivity, the harder the thermal pad, because we need to fill more thermally conductive powder into resin. The customer designed a 0.3mm gap which filled by a 1.5 mm thick thermal pad, that means a compression rate of 80% is needed. This is the biggest advantage of Fujipoly GR45A. We recommended XK-P60 to customer and sent them a sample for testing. One day later, the customer fed back,”I was surpprised, your sample exhibited similar technical data to Fujipoly GR45A, thermal conductivity is 8.0W/mK and compression rate is up to 80%, it perfectly substitutes for GR45A, I will recommend your product to our team.” GLPOLY thermal gap pad XK-P60 is high thermal performance, high compression gap filling pad. This material features high thermal conductivity and low thermal impedance, providing effective heat transfer from heat source to heatsink and helps keep your devices cool and performing at their best.

Minimum Order: 10 long tons

Many engineers know that 3M, Fujipoly, Bergquist can provide silicone-free thermal gap pad, but they don’t know who can make it in Chinese local market. GLPOLY had invested a large amount of resources to develop silicone-free thermal gap pad for years. Now we have developed XK-PN series silicone-free thermal pad successfully, taking these top brand as reference samples. We take GLPOLY XK-PN45 and 3M 5500H as example, let us check the comparison. Usually two parameters will be considered carefully---thermal conductivity and thermal impedance for judging the performance of thermal pad. One of our customer requested a silicone-free thermal pad from us which can provide similar thermal performance to 3M 5500H. 3M 5500H was tested by two method, in-house test and ASTM D5470. The thermal conductivity is 3.0W/mK and 2.0W/mK respectively. GLPOLY silicone-free thermal pad was tested by ASTM D5470, an authoritative test method, exhibiting an thermal conductivity of 4.5W/mK. To any professional, this is more reliable. Let us check the thermal impedance. 3M 5500H doesn’t mark the value, but we can calculate according to thermal conductivity and thickness. We figured out an thermal impedance of 0.63℃in2/W for 3M 5500H silicone-free thermal pad. GLPOLY XK-PN45 provides a thermal impedance of 0.18℃in2/W, it’s only one fourth of that of 3M 5500H. obviously, GLPOLY XK-PN45 offers higher thermal performance than 3M 5500H. GLPOLY has been a thermal management materials manufacturer for more than ten years. We have been providing thermal management materials for Huawei, DJI and GAC.

Minimum Order: 10 long tons

GLPOLY thermal gap pad XK-P80 is a dark horse in thermal interface materials industry, designed to solve thermal management problem of 5G telecom equipment. It is constructive to said that XK-P80 thermal gap pad is a preferred thermal solution for thermal management of 5G telecom equipment. 1. Thermal conductivity 8.0W/mK, low thermal resistance; 2. Conformable to component topography, improve thermal contact; 3. Loyal users such as DT Mobile, ZTE, DJI, NIO Motor and more; It was said that there were many thermal interface materials can be applied to 5G telecom equipment thermal management, actually, to many thermal management engineers, it was not easy to find a proper thermal interface materials for 5G telecom applications, they found that performance of most of thermal interface materials were inconsistent with what they claimed, lower performance, low reliability etc., this was true. GLPOLY has always been at the leading edge of technological development of thermal interface materials. In order to fulfill the demand of 5G telecom equipment thermal management, GLPOLY had developed a thermal gap pad with a thermal conductivity of 8.0W/mK. This thermal gap pad had been verified by DT mobile, a leading telecommunication equipment manufacturer in China. No matter the thermal performance, reliability or service life, GLPOLY thermal gap pad XK-P80 could met customer’s requirements. XK-P50 is an exceptional performance, low thermal resistance thermal gap pad, it is conformable to component topography improving thermal contact and maxmizing heat transfer. GLPOLY has a complete portfolio of thermal interface materials, applying to new energy electric vehicle (battery pack, motor control unit, electronics control unit), consumer electroncis, security, medical equipment, military equipment and more. GLPOLY has partnered with Han’s Laser, dJI, CATL, GAC NE, NIO Automotive etc., delivering advanced technological thermal management solutions. GLPOLY thermal interface materials provides superior quality and design flexibility.

Minimum Order: 10 long tons

non-dry out, non-curing non-silicone thermal gel, maybe no one else can provide except GLPOLY. In the last several years, few of thermal management engineers would intergrate “non-silicone” thermal interface materials in their application due to less referentical cases, silicone based thermal interface materials were priority. GLPOLY was the first thermal interface materials manufacturer that provided diversified thermal management materials including non-silicone materials in China. Non-silicone thermal gel, for instance, there were few choices for customers at present, some suppliers provided y grease instead of non-silicone thermal gel, socking customers’ interests. One customer wanted to intergrat paste material in camera, siloxane volatiles were not allowed due to concerns of optic component atomization. Also customer requested that thermal gel should be non-dry out, non-curing. Taking all the factors, non-silicone thermal gel would be the best solution. They consulted with many suppliers, but they just collected two samples finally because there was just a few choices on non-silicone thermal gel in the market. GLPOLY XK-GN30 was the third one they selected. All samples would be verified for silicone free and high temperature aging test. Three non-silicone thermal gel were approved by siliocne free test. But huge variations was showed up in the high temperature test at 105C for 1000 hours. The temperature of the devices which competing products applied was out of expectation, when they took apart components, they found the non-silicone thermal gel was dry out. Only the one with GLPOLY XK-GN30 applied performed stable. As our discussion and analysis, the competing products were thermal grease, it would dry out under high temperature. In the next month when we attended a fair, we invited customer to visit out booth and leared more about XK-GN30 non-silicone thermal gel, and finally we established business relationship. GLPOLY non-silicone thermal gel is a high performance gap filling material, designed to eliminate siloxane concerns for precise or optic component intergrated devices. This material is compatible with automated dispense process, accommodating a variety of gap thickness. GLPOLY thermal interface materials has been applying to cosumer electronics, military equipment, medical equipment, drone, automotive electronics and EV battery pack, serving top class customers like LG, dJI, GAC NE, NIO Automotive, DT Mobile and more. GLPOLY thermal interface materials provides considerate service for you.

Minimum Order: 10 long tons

GLPOLY thermal gap pad XK-P60-PUTTY is an analogue that can substitute for Laird Tflex HD700 with high thermal performance and high compression. You will find that a lot of suppliers said they can provide substitute for Laird Tflex HD700 because our product provides the same thermal conductivity. Is it true? When you review the datasheet or you know even just a little about thermal gap pad, you can find that thermal conductivity is not the most important, it does not meam thermal cnductivity is not vital, but compared to the products which is with similar thermal performance, Laird Tflex HD700 provides higher compression and conformability. With benchmark of Tflex HD700, GLPOLY released XK-P60-PUTTY with high performance and compression as a perfect substitute for Tflex HD700. A customer searched us from internet and asked “can you really provide a perfect alternative part to Laird Tflex HD700 or just provide a similar product”. “Perfect alternative with thermal and physical properties, test result will show you what it really is”. We provided a XK-P60-PUTTY in 1.5mm thick after customer gave me application information of power and gap size. The test last for two weeks, customer was satisfied with result when test was finished. Customer told me that they bought a Laird Tflex HD700 from electronic material supplier on internet while he took samples from me for comparing. The temperature is 65 degree when performing with Tflex HD700, it was good, but GLPOLY thermal gap pad was better, the temperature was maintained under 60 degree. The chief engineer sent me a message, just one word ”excellent”. GLPOLY thermal gap pad XK-P60-PUTTY is high performance, high compression gap filling material with thermal conductivity of 6.0W/mK. It provides high deflection under low compressive forces, decreasing stress on component and avoiding component failures. GLPOLY is qualified partner to Huawei, ZTE and DJI, also GLPOLY thermal materials have been applied in new energy electric vehicle. GLPOLY is committed to delivering advanced thermal management solutions for top class clients.

Minimum Order: 10 long tons