Electronics & Electrical

How Liquid Cooling Plates Improve Cooling Efficiency in Servers NVIDIA GPU 3090 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202311 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：350 Working environment：50°C,1LPM,30%EGW cold plate surface temperature：below61°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Comparing Liquid Cooling Plates and Air Coolers for Electronic Systems Intel Eagle-stream liquid cooling plate 350W×2 The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Thermal design optimization, structural design. 》Apply solder and heat and solder. 》Drilling, welding, surface treatment and other processes. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202310 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：350W×2 Working environment：40°C,1.2LPM,25%EGW cold plate surface temperature： below52°C flow resistance：Below16KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Custom Liquid Cooling Plates for Optimizing Heat Transfer in Electronics Intel Eagle-stream liquid cooling plate 700W×2 The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Thermal design optimization, structural design. 》Apply solder and heat and solder. 》Drilling, welding, surface treatment and other processes. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202309 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：700W×2 Working environment：40°C,1.1LPM,25%EGW cold plate surface temperature： below64°C flow resistance：Below16KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Liquid Cooling Plates for Efficient Heat Dissipation in Industrial Equipment NVIDIA GPU H800 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving, environmental protection, and space utilization. 》Enhance system reliability and reduce noise. 》TLP welding, no pollution to the environment. 》Heat recovery, internal installation. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202308 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：350W Working environment：45°C，0.9LPM，40%EGW cold plate surface temperature： below56°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Designing Effective Liquid Cooling Plates for High-Temperature Applications NVIDIA GPU 4090 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and environmental protection. 》Single width design, fluid media. 》Space utilization, reliability. 》Using heat pipe technology and sealing materials. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202307 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：450W Working environment：48°C，1LPM，20%PGW cold plate surface temperature： below65°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Advanced Liquid Cooling Plate Solutions for High-Thermal-Load Environments NVIDIA GPU A6000 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, coolant flow rate, and space utilization. 》Heat dissipation structure design and circulation system design. 》Drilling, welding, surface treatment and other processes. 》Using heat pipe technology and sealing materials. 》Can be customized according to customer conditions. Model ：T-HS202306 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：300W Working environment：50°C,1LPM,34%EGW cold plate surface temperature：below62°C flow resistance：Below2.5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Top Benefits of Using Liquid Cooling Plates in Modern Computing NVIDIA GPU 4090 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and environmental protection. 》Double wide design, fluid media. 》Space utilization, reliability. 》Drilling, welding, surface treatment and other processes. 》Can be customized according to customer conditions. Model ：T-HS202305 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：450W Working environment：35°C，0.5LPM，34%EGW cold plate surface temperature： below55°C flow resistance：Below 8KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

How to Choose the Right Liquid Cooling Plate for Your Server GPU TTC-1000W/1200W/1500W liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and consumption reduction, and increased equipment density 》Enhance system reliability and reduce noise 》Friction welding, no pollution to the environment 》Flow channel processing, vacuum brazing, laser welding 》Can be customized according to customer conditions. Model ：TTC-1000 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1000W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa Model ：TTC-1200 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1200W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa Model ：TTC-1500 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1500W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Efficient Liquid Cooling Plates for High-Power GPU Systems NVIDIA GPU A100/A800 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》One-piece molding, light weight, good performance。 》Special flow path design, uniform cooling surface 》Friction welding, no pollution to the environment 》Seamless and perfect joint, no worries about leakage 》Can be customized according to customer conditions. Model ：T-HS202303 Category：NVIDIA GPU Welding process：Aluminum alloy friction stir welding heat source Total power： 350W Working environment：50°C,1.5LPM,57%EGW cold plate surface temperature：below 55°C flow resistance：Below 9KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Custom Liquid Cooling Plates for Advanced Electronic Applications Intel CPU X3 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, solid structure, and optimized thermal management. 》Performance is improved. After using the liquid cooling plate, the failure rate caused by CPU overheating is reduced by 50%. 》Runner processing, brazing packaging 》anodizing. 》Can be customized according to customer conditions. Model ：T-HS202302 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：270W Working environment：45°C,1LPM,45%PGW cold plate surface temperature：below 56°C flow resistance：Below 1.5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

High-Performance Liquid Cooling Plates for Data Centers AMD CPU liquid cooling plate SP5 liquid cooling plate AMD CPU SP5 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》High thermal conductivity material, precision processing. 》TLP welding, post-processing process. 》Efficient cooling performance, reliability and durability. 》Environmental protection and energy saving. 》Intelligent management, maintainability and flexibility. Model ：T-HS202301 Category：AMD CPU Welding process：pure copper TLP welding heat source Total power：500W Working environment：40°C,2LPM,25%EGW cold plate surface temperature：below 52°C flow resistance：Below 10KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

The PMC-GBIT-DT2BP PMC610J4RC is a dual-channel Gigabit Ethernet interface module designed for real-time data transfer applications, especially in industrial automation systems. The module supports two independent Gigabit Ethernet ports, offering fast and reliable communication.

Minimum Order: 1 bags

The UR7HH is a versatile and reliable industrial control device designed for use in various automation and control applications. Known for its robustness and advanced features, this device is integral to maintaining effective and efficient operations in demanding environments. Key Features: High Performance: The UR7HH delivers reliable performance in process control, ensuring accurate and timely operation of industrial processes. Durable Construction: Built to withstand harsh industrial conditions, the device is resistant to extreme temperatures, vibrations, and electrical noise, ensuring long-term reliability and durability. Versatile Functionality: This device supports a range of functions and applications, providing flexibility to meet diverse process control and automation needs. Seamless Integration: Designed to integrate easily with existing control systems, the UR7HH enhances system efficiency and communication. Compact Design: Its compact form factor allows for efficient installation in control cabinets and tight spaces, optimizing space usage without sacrificing performance.

Minimum Order: 1 bags

The GE 531X113PSFARG1 is a high-performance relay module designed for use in GE's industrial control systems. This module is part of GE’s extensive range of automation and control solutions, providing reliable performance for various industrial applications. Key Features: Robust Relay Functionality: The 531X113PSFARG1 offers dependable relay switching capabilities, essential for controlling and managing industrial processes effectively. High Durability: Engineered to withstand challenging industrial environments, the module is designed to operate reliably under extreme temperatures, vibrations, and electrical noise. Versatile Application: This module is suitable for a wide range of control and automation tasks, providing flexibility in meeting different process requirements. Easy Integration: Designed to integrate seamlessly with GE’s control systems, the 531X113PSFARG1 ensures efficient communication and coordination within the overall system. Compact Design: The module’s compact form factor allows for efficient installation in control cabinets, optimizing space usage without compromising functionality.

Minimum Order: 1 bags