Electronics & Electrical

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Advanced Heat Sink for Enhanced Heat Dissipation

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Maximize Efficiency with Coolserver’s Precision Engineered Heat Sinks CPU CPU coolserver S2 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80803460 Processor architecture：AMD SP3 ILM Chassis architecture： 2U Server and Up ( Active ) size：120.0 x 80.0 x 63.5 mm Power consumption：240W Material：AL Base + Cu Block +AL Fin + 4HP + 6025 Fan Thermal paste：Dow Corning TC-5218 Fan model：TD6025B12HA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：1.0 A Rotating speed：9000±10% RPM Bearing：Two Ball Air volume：50.3 CFM wind pressure：25.75 mm H2O noise： 49.60 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

How Coolserver's Thermal Solutions Enhance Server Performance and Longevity CPU coolserver P7 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80805680 Processor architecture：Intel FCLGA 3647 Narrow ILM Chassis architecture：4U Server and Up ( Active ) size：108.0 x 92.5 x 126.3 mm Power consumption：300W Material：AL Base + Cu Block +AL Fin + 6HP+ 9225 Fan Thermal paste：Shin-Etsu X23-7783D Pre-Applied Fan model： TD9225B12UA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：1.0 A Rotating speed：4700±10% RPMBearing：Two Ball Air volume：86.29CFM wind pressure：11.17 mm H2O noise：36.6 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

Why Choose Coolserver for Your Custom Heat Sink and Cooling Plate Needs CPU coolserver P8 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80802510 Processor architecture：Intel FCLGA 3647 Square ILM Chassis architecture：2U Server and Up ( Active ) size：91.0 x 88.0x 64.0 mm Power consumption：205W Material：AL Base + Cu Block +AL Fin + 4HP + 6025 Fan Thermal paste：Dow Corning TC-5218 Fan model：TD6025B12HA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：0.45 A Rotating speed：6800±10% RPM Bearing：Two Ball Air volume：41.4 CFM wind pressure：14.74 mm H2O noise： 47.67 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

Coolserver’s Reliable Cooling Systems for High-Performance Electronics CPU coolserver P9 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80805580 Processor architecture：Intel FCLGA 4189 Narrow ILM (Whitley) Chassis architecture：4U Server and Up ( Active ) size：113.0 x 95.0 x126.3mm Power consumption：330W Material：AL Base + Cu Block +Cu Fin + 4HP Thermal paste：Shin-Etsu X23-7783D Pre-Applied Fan model：TD9225B12UA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：1.0 A Rotating speed：4700±10% RPM Bearing：Two Ball Air volume：86.29CFM wind pressure：11.17 mm H2O noise： 36.6 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

Coolserver’s Innovative Heat Sink Designs for Improved Heat Dissipation CPU coolserver H1 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80805770 Processor architecture：Intel Socket 115X ILM Chassis architecture：2U Server and Up ( Active ) size：96.0 x 88.0 x 67.0 mm Power consumption：220W Material：AL Base + Cu Block +AL Fin + 4HP+ 6025 Fan Thermal paste：Shin-Etsu X23-7783D Pre-Applied Fan model：TD6025B12HA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：1.0 A Rotating speed：9000±10% RPM Bearing：Two Ball Air volume：50.3CFM wind pressure：25.75 mm H2O noise：49.6 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

Coolserver: Leading Provider of Custom Heat Sinks for Industrial Equipment CPU coolserver P9 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80802000 Processor architecture：Intel Socket 115X & 2011 Square & 2011 Narrow Chassis architecture：3U Server and Up ( Active ) size：109.95 x 95x 127 mm Power consumption：150W Material：AL Base + Cu Block + AL Fin + 5HP + 9225 Fan Thermal paste：Shin-Etsu X23-7783D Pre-Applied Fan model： TD9225B12HA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：0.35 A Rotating speed：3300±10% RPM Bearing：Two Ball Air volume：53.42CFM wind pressure：4.55 mm H2O noise： 34.2 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons

Top Benefits of Using Coolserver Heat Sinks for Electronic Devices CPU coolserver W2 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer. Small batch customization with quick proofing 》Efficient heat dissipation and intelligent temperature control. 》Compatibility and easy installation. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Durability and reliability. 》Seamless and perfect joint, no worries about leakage. Model ：80803390 Processor architecture：Intel FCLGA 3647 Narrow ILM Chassis architecture：4U Server and Up ( Active ) size：108.0 x 95.0 x 126.3 mm Power consumption：240W Material：AL Base + Cu Block +AL Fin + 5HP+ 9225 Fan Thermal paste：Shin-Etsu X23-7783D Pre-Applied Fan model：TD9225B12UA Rated voltage：12 VDC Starting voltage：7.0 VDC Rated current：1.0 A Rotating speed：4700±10% RPM Bearing：Two Ball Air volume：86.29CFM wind pressure：11.17 mm H2O noise： 36.6 dBA PWM function：PWM Control Safety certification：UL & CE Environmental protection level：RoHS 2.0 Plug terminal：2510 – 4Pin; Pin1,4

Minimum Order: 10 long tons