Electronics & Electrical

The DS200RTBAG3AHC is a terminal board produced by General Electric (GE) as part of their Mark V Speedtronic control system for gas and steam turbines. This board provides critical I/O connections, serving as an interface between field devices (such as sensors, actuators, and relays) and the turbine control system. It ensures proper signal routing and reliable communication between the turbine control hardware and external systems. Key Features: I/O Termination: Provides termination points for a variety of input and output signals, enabling communication between external devices and the control system. Signal Distribution: Ensures proper signal routing between field devices and turbine control, facilitating smooth and efficient operations. Easy Integration: Designed to integrate seamlessly with GE's Mark V turbine control system, simplifying installation and maintenance. Durable Design: Built to withstand harsh industrial environments, ensuring reliable performance in power plants and industrial settings. Diagnostic Capabilities: Includes status indicators and built-in diagnostics to monitor system health and quickly identify issues.

Minimum Order: 1 bags

The 745-W3-P5-G5-HI-A-L-R-E-H is a GE Multilin motor protection relay from the 745 series, specifically designed for the protection, control, and monitoring of medium to large-sized motors. It is ideal for use in industrial environments where motors are critical to the operation. This advanced relay provides comprehensive protection against a wide range of faults, ensuring the reliability and safety of motors in demanding applications. Key Features: Motor Protection: Offers extensive protection functions, including overload, undercurrent, phase unbalance, phase loss, ground faults, and thermal protection to safeguard motors from potential damage. Advanced Monitoring and Diagnostics: Provides real-time monitoring and diagnostics of motor performance, enabling operators to identify and address issues proactively. High Current Sensitivity: Rated for high current applications, making it suitable for motors with higher power requirements. Communication Capabilities: Supports multiple communication protocols for easy integration into larger control systems, including Modbus, DNP 3.0, and IEC 61850.

Minimum Order: 1 bags

The IC220MDL753 is a digital input module manufactured by GE for use in the VersaMax series of programmable logic controllers (PLCs). This module is designed to interface with industrial automation systems, providing reliable digital signal input for process monitoring and control tasks. The IC220MDL753 is a 32-point discrete input module that supports 24V DC signals, allowing it to read and process a variety of digital inputs from sensors, switches, and other devices. Key Features: 32 Digital Inputs: Provides 32 input channels for reading digital signals, allowing extensive input capacity for automation systems. 24V DC Signal: Designed to handle 24V DC input signals, ensuring compatibility with a wide range of industrial sensors and devices. High Noise Immunity: Built with noise suppression technology to prevent signal interference in noisy industrial environments. Compact Design: Part of the VersaMax family, this module offers a compact form factor, ideal for space-constrained control panels. Status Indicators: Features LED indicators for each input channel, allowing easy monitoring of signal status and troubleshooting.

Minimum Order: 1 bags

The IS200EROCH1ADD is a GE Excitation Regulator Output Control Board, primarily used in GE’s EX2100 excitation control systems. This board is a key component in the regulation and control of generator excitation, ensuring the stable operation of synchronous generators in power generation systems. The IS200EROCH1ADD controls the excitation current supplied to the generator’s field winding, maintaining optimal generator voltage and reactive power under varying load conditions. Key Features: Excitation Control: Precisely regulates the excitation current to maintain generator stability and performance during operation. Voltage Regulation: Provides accurate voltage regulation for synchronous generators, ensuring consistent voltage output. Fault Detection: Built-in diagnostics to monitor system health and detect faults in excitation control, helping prevent equipment damage. Redundant Design: Supports redundant configurations for increased reliability in critical power generation applications. Easy Integration: Designed to seamlessly integrate into GE’s EX2100 excitation systems, offering a flexible and scalable control solution.

Minimum Order: 1 bags

The 269PLUS-D/O-211-100P-120VAC is an advanced motor protection relay from GE Multilin, designed to provide comprehensive protection and control for medium and large motors. This device is equipped with multiple protection functions to safeguard motors from overloads, undercurrent, phase loss, and other electrical faults, ensuring reliable operation in industrial environments. Key Features: Comprehensive Motor Protection: Protects against motor overload, phase unbalance, phase loss, and ground faults, ensuring motor reliability and safety. Real-Time Monitoring: Provides real-time motor monitoring and diagnostics, allowing operators to detect and prevent potential issues before they cause damage. Flexible Input/Output: Equipped with digital and analog I/O for easy integration with control systems. Programmable Settings: Allows for customizable protection settings based on the specific motor and application requirements. User-Friendly Interface: Includes a clear display and navigation system for ease of use, configuration, and troubleshooting. 120VAC Power Supply: Operates on a 120V AC power source, making it suitable for a wide range of industrial applications.

Minimum Order: 1 bags

The DS200SIOBH1ABA is a GE (General Electric) I/O (Input/Output) Control Board, primarily used in the GE Speedtronic Mark V turbine control system. This board plays a critical role in managing the communication between the central control system and peripheral devices, ensuring the smooth operation of gas and steam turbines. The DS200SIOBH1ABA is designed to interface with various input and output signals, providing the necessary control for turbine operations. Key Features: I/O Signal Management: Handles a wide range of input and output signals, supporting turbine system control and monitoring. High Reliability: Designed for continuous and stable operation in demanding industrial environments, particularly in power generation. Built-in Diagnostics: Provides onboard diagnostics and troubleshooting functions to ensure system health and performance. Modular Design: Easily integrated into GE’s Mark V control system for enhanced flexibility and system expansion. Redundant Communication: Ensures reliable communication between the turbine control system and external devices, reducing the risk of communication failures.

Minimum Order: 1 bags

Laser Tungsten Copper Bar Tungsten-copper alloy is a pseudo alloy. Tungsten and copper are not miscible. It combines the high thermal conductivity, high melting point, and low thermal expansion coefficient of tungsten with the high thermal conductivity of copper. The ratio of tungsten to copper can be adjusted arbitrarily as WxCuy, where x+y=100. The table below shows only a portion of the commonly used grades. Our tungsten-copper alloy can achieve nearly completely dense, defect-free, fine- grained structure. The helium mass spectrometer leak detection material's airtightness is <5x10-9 Pa/m3.s, which is comparable to foreign products.

Minimum Order: 10 long tons

Silicon aluminum series Silicon aluminum is a metal ceramic material that maximizes the low density and high thermal conductivity of aluminum, while also possessing the low thermal expansion and high thermal conductivity of silicon. It is primarily utilized for aerospace packaging tube shells. Silicon aluminum is a material that substitutes aluminum silicon carbide. While its thermal conductivity is slightly lower than that of aluminum silicon carbide, it has lower hardness and better machining performance. In addition to the grades in the table below, we can also provide gradient silicon aluminum materials.

Minimum Order: 10 long tons

Molybdenum copper series Molybdenum-copper alloy is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily, MoxCuy, where x+y=100. The following table shows only a portion of the commonly used grades. Our molybdenum-copper alloy can achieve almost completely dense, defect-free, fine-grained structure. The air tightness of the helium mass spectrometer leak material is <5x10-9 Pa/m3.s, which is comparable to foreign products. Compared with tungsten copper, molybdenum copper has lower density and better rollability, making it suitable for the production of thin strip products. Additionally, molybdenum copper can be stamped, making it suitable for the cost-effective mass production of heat sink parts.

Minimum Order: 10 long tons

Laser Tungsten Copper Bar Lasers come in many different qualities, and carbon dioxide lasers are still used in certain specific situations. However, solid-state lasers are currently the main type, and semiconductor lasers are the most common. The use of "crystal" oxygen-free copper heat sinks was prevalent over a decade or two ago. The power density was relatively low, and tin was typically used as solder. Oxygen-free copper heat sinks can be utilized, nickel-plated instead of gold-plated, but gold-plated soldering offers better reliability. The tungsten copper bar structure was developed to meet the demands for high power, high reliability, and long lifespan. Early lasers primarily utilized tungsten copper C-Mount structures, which later transitioned to tungsten copper bars. Initially, W85Cu15 was predominant, but currently, W90Cu10 is the main composition. It is suggested to experiment with W93Cu7 in the future. Tungsten copper bars serve as conductors, heat sinks, and chip carriers. Gallium nitride chips are sandwiched between them and soldered with gold-tin solder. Several laser modules utilize tungsten copper bars, varying from a few to dozens of pieces. In the early days, about 10 years ago, the power of laser chips was not high, and the requirements for tungsten copper bars were not stringent. Now, the power is increasing, and the demands for tungsten copper bar size accuracy, thermal expansion coefficient matching, thermal conductivity, and coating bonding are becoming more rigorous. This is mainly evident in the need for the thermal expansion coefficient to be close to gallium arsenide (5.9x10- 6/K), maximizing thermal conductivity, experimenting with diamond composite materials, and enforcing strict control over key surfaces, finishes, edges (R10 microns), and coatings (nickel, gold, platinum, and locally prefabricated gold and tin). A decade ago, we were the sole manufacturer of tungsten copper bars in China, but now many manufacturers are entering this field.

Minimum Order: 10 long tons

Diamond Copper/Aluminum Series Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient. Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper. Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

Diamond Copper/Aluminum Series Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal conductivity of Kovar, Invar, and steel is much lower than that of molybdenum and molybdenum-copper alloy, their prices are lower, and the yield rate of composite materials is higher. Therefore, the cost is much lower than that of CMC and CPC. According to literature reports,copper/Kovar/Copper,copper/Invar/Copper,an , d copper/Steel/Copper products are widely used internationally. We have developed these products for domestic research institutes and supplied them in small batches, but they have not been widely promoted.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons