Electronic & Electrial Accessories

Silicon aluminum series Silicon aluminum is a metal ceramic material that maximizes the low density and high thermal conductivity of aluminum, while also possessing the low thermal expansion and high thermal conductivity of silicon. It is primarily utilized for aerospace packaging tube shells. Silicon aluminum is a material that substitutes aluminum silicon carbide. While its thermal conductivity is slightly lower than that of aluminum silicon carbide, it has lower hardness and better machining performance. In addition to the grades in the table below, we can also provide gradient silicon aluminum materials.

Minimum Order: 10 long tons

Molybdenum copper series Molybdenum-copper alloy is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily, MoxCuy, where x+y=100. The following table shows only a portion of the commonly used grades. Our molybdenum-copper alloy can achieve almost completely dense, defect-free, fine-grained structure. The air tightness of the helium mass spectrometer leak material is <5x10-9 Pa/m3.s, which is comparable to foreign products. Compared with tungsten copper, molybdenum copper has lower density and better rollability, making it suitable for the production of thin strip products. Additionally, molybdenum copper can be stamped, making it suitable for the cost-effective mass production of heat sink parts.

Minimum Order: 10 long tons

Laser Tungsten Copper Bar Lasers come in many different qualities, and carbon dioxide lasers are still used in certain specific situations. However, solid-state lasers are currently the main type, and semiconductor lasers are the most common. The use of "crystal" oxygen-free copper heat sinks was prevalent over a decade or two ago. The power density was relatively low, and tin was typically used as solder. Oxygen-free copper heat sinks can be utilized, nickel-plated instead of gold-plated, but gold-plated soldering offers better reliability. The tungsten copper bar structure was developed to meet the demands for high power, high reliability, and long lifespan. Early lasers primarily utilized tungsten copper C-Mount structures, which later transitioned to tungsten copper bars. Initially, W85Cu15 was predominant, but currently, W90Cu10 is the main composition. It is suggested to experiment with W93Cu7 in the future. Tungsten copper bars serve as conductors, heat sinks, and chip carriers. Gallium nitride chips are sandwiched between them and soldered with gold-tin solder. Several laser modules utilize tungsten copper bars, varying from a few to dozens of pieces. In the early days, about 10 years ago, the power of laser chips was not high, and the requirements for tungsten copper bars were not stringent. Now, the power is increasing, and the demands for tungsten copper bar size accuracy, thermal expansion coefficient matching, thermal conductivity, and coating bonding are becoming more rigorous. This is mainly evident in the need for the thermal expansion coefficient to be close to gallium arsenide (5.9x10- 6/K), maximizing thermal conductivity, experimenting with diamond composite materials, and enforcing strict control over key surfaces, finishes, edges (R10 microns), and coatings (nickel, gold, platinum, and locally prefabricated gold and tin). A decade ago, we were the sole manufacturer of tungsten copper bars in China, but now many manufacturers are entering this field.

Minimum Order: 10 long tons

Diamond Copper/Aluminum Series Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient. Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper. Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Aditionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS- CMC is a multilayer composite sheet with holes in the core molybdenum plate. The central core hole is flled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons