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Home > Offers to Sell > Consumer Electronics > Others > Others
Contact: |
phonefixNicole |
Company: |
Shenzhen weixiu technology Co.,Ltd |
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JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District, |
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shenzhen 518116 |
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China |
Phone: |
18929708712 |
Fax: |
+86 0755-21005627 |
E-Mail: |
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Date/Time: |
5/19/23 3:41 GMT |
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Qianli IP-01 02 BGA Ball Mounting Platform
QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for iPhone X XS XS MAX 1 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for iPhone logic board repair net fixture
Features : Durable, unique design Seiko, featured material Precise positioning Efficiency Improvement Strong magnetic attraction Stencils won't deform under high temperature High quality Phone Middle Frame Reballing Platform BGA Reballing Platform for Phone X/XS/XS MAX/11/11 Pro/11 Pro MAX. Make your repair work easier
Minimum Order: 1 pieces
Click to Enlarge
SOURCE: Import-Export Bulletin Board (https://www.imexbb.com/)
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