Qianli 4 IN 1 middle frame reballing platform

Qianli 4 IN 1 middle frame reballing platform for iPhone 13/13 Pro/13 Pro
Max/13 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for
iPhone 13 series. Qianli iPhone 13 series 4 in 1 double-sided middle layer
reballing stencil platform regular/simple version for iPhone 13 motherboard
soldering repair. Qianli 4 in 1 motherboard tin planting platform for iPhone
13-13 Pro Max.

Features:
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative
single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom
Silicone anti-slip foot pads are used at the bottom to effectively isolate
the temperature, anti-skid and anti-scald, so that the tin planting position
is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing
platform Precise positioning for the motherboard in high precision, strong
magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.

User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that
needs reballing to the corresponding positioning pins. Place it in the
synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and
put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding
temperature to the reballing hole, make sure that each hole is covered with
solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and
operate. Use the hot air gun to heat the corresponding reballing hole.

Minimum Order: 1 pieces

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