Planar Metal Sputtering Targets

Excellent properties such as high purity, high density, high thermal
conductivity, high stability, uniform grain, etc.
High purity: The metal target requires very high purity, to ensure the
stability and reliability of the material.We have various purity levels to suit
your specific requirements, with the minimum purity of 99.5% up to 99.9999% for
some metals. Also have controlled specific impurities within the target
High density: Metal targets have high density characteristics, usually up to
99%, to ensure the stability and quality of materials.
Uniform grain: Controlled grain size and direction
Good composition uniformity: the component distribution is uniform, ensure the
film formation rate is uniform, film quality.

Manufacturing processes
Manufacturing processes depend on the properties of the target material and its
application.
We have (Vacuum melting, Rolling, Vacuum spraying, Atmospheric spraying, Vacuum
hot pressing, Hot Isostatic Pressing (HIP), Cold Isostatic Pressing +Various
atmosphere sintering technology, Low temperature metal, Vacuum hot pressing
sintering technology, Electron beam melting, Zone melting purification, Vacuum
directional solidification technology, etc).
For metal and alloy target, we adopt Vacuum melting, Rolling, Low temperature
metal,Vacuum hot pressing sintering, Electron beam melting, Zone melting
purification, Vacuum directional solidification technology.
Both Planar and Rotary target available

Planar target
Planar targets mainly refer to circular targets and rectangular targets with
certain thickness. The plane target material is connected with sputtering
equipment by means of thread, the sputtering film layer is attached to the
substrate under vacuum conditions, and then the film is processed by various
methods to meet different needs.

Rotary target
Rotary target is a magnetically controlled target. The target is shaped like a
cylinder containing a stationary magnet for rotation. Its advantage is high
utilization rate, the disadvantage is high cost.

Reference size
* Maximum sizes of planar target
   Thickness: 30mm (can be 60mm for round target)
   Width: max 2000mm
   Length: max 4000mm

* Maximum sizes of rotary target
   Vacuum/Air Spraying
   Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm
   Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm
   Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm
   Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm

Bonding
Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm

* Maximum sizes of planar target
   Thickness: 30mm (can be 60mm for round target)
   Width: max 2000mm
   Length: max 4000mm
* Maximum sizes of rotary target
   Vacuum/Air Spraying
   Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm
   Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm
   Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm
   Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm

Bonding
Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm

Metal sputtering targets are materials extensively utilized in modern
industry. They are primarily employed in the sputtering process for thin film
deposition across various industries, including semiconductor, electronics,
optics, and surface coating. It is a method of transforming a solid material
into a liquid or gaseous state and accelerating it to the target surface using
physical vapor deposition techniques. It uses ions produced by an ion source to
gather at an accelerated rate in a vacuum, forming a high- speed ion beam that
bombards a solid surface. The ions exchange kinetic energy with the solid
surface atoms, causing the solid surface atoms to leave the solid and deposit
on the base surface.If you need any information or a quote please contact us,
you can contact our sales team directly or fill out the form below and we will
get back to you in time.

Click to Enlarge