Peelable S/M 2Layers Lead Free HASL FR4

Peelable S/M 2Layers Lead Free HASL FR4
Product Description
Damage from additional thermal deviation
Coplanarity issues due to pad-to-pad coating thickness variations
Potential coplanarity issues with HASL finishes
Stencil spacer issues are related to differences in coating thickness and
mushroom cap profile (coating) on small pads.
The difference in solder coating thickness for lead-free HASL coatings is
typically about half the thickness of tin-lead HASL coatings. In this finish,
coplanarity is also good. Modern HASL lines are designed to provide operating
conditions consistent with other equipment in modern cardboard workshops to
avoid heat and smoke problems.
Due to the higher surface tension of lead-free solder, the coating formed in
the HASL process is thin and uniform compared to tin-lead solder formed under
similar conditions.
The coating thickness can be checked by XRF (X-ray Fluorescence Spectroscopy)
technology.
Compressive stress is the driving force for whiskers (filaments protruding from
the surface of a board with tin as the final finish).
Lead Free HASL offers a corrosion-resistant finish that ensures long-term
solderability.
Application area: Security Product feature: Peelable S/M
Layer: 2 Surface treatment: Lead Free HASL
Material: FR4 Line width/Line space: 0.325/0.305mm
Thickness: 1.6mm Min hole φ: 0.75mm

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