Mijing K35 Logic Board Soldering Holder Fixture

Mijing K35 tin planting platform with BGA reballing stencil for Phone 12 Mini
12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil
for Phone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair.

Product Features :
Install the Phone 12/12 Mini/12 Pro/12 Pro Max main board on the platform
Cover the Phone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on
mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the
tin point.

Product Specification :
Item Name: MJ K35 Tin Platform
Brand: MiJing
Model: K35
Material: Imported synthetic stone material
Color: Blue + Silver
Size: 120*115*20mm
Weight: 350g
Suit For: Phone 12/12 Mini/12 Pro/12 Pro Max
Application: For Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower
layers logic board soldering repair.

Minimum Order: 1 pieces

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