Mijing iRepair MS1 Soldering heating Staion

Mijing iRepair MS1 Soldering heating Staion MS1-14 module for Phone 14/14
Plus/14 Pro/14 Pro Max. iRepair MS1 desoldering preheating platform For Phone
X-14 Pro Max motherboard CPU IC heating disassembly and glue removal.

Feature:
1. iRepair MS1 pre-heating staion for Phone X/XS/XS MAX/11/11Pro/11 Pro
Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14
Pro/14 Pro Max motherboard soldering separating.
2. Mijing iRepair MS1 Multi-function Desoldering Station
3. Newly upgraded heating element, fast heating, precise temperature control
4. Added countdown function, layering and fitting are more secure
5. Phone X -14 Pro Max module + universal module + dot matrix module +
follow-up unlimited upgrades.
6. Precise positioning, precise temperature, rapid temperature rise, non-slip
weight increase, digital display temperature, intelligent 15 minutes sleep,
183° three minutes extreme speed rise, fast stratification, safe
disassembly, no damage to the motherboard.

Minimum Order: 1 pieces

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