MicroSD/TF memory substrate factory

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package
substrate,Semiconductor package;



When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout
software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up
information;



Spec.of pcb production:

Mini.Line space/width:1mil (25um)

Finished thickness:FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-
FR4),mitsuiseiki,O , hmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic, , Others;

Surface finished:Mainly immersion gold,ENEPIG,support customize such as
OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Improved tenting process:20/20um;

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