Mechanic Heat Kit Reflow Soldering Preheating Platform

Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform with 3.4inch
Screen Display for Phone 11 to 13Pro Max Motherboard Repair, Intelligent
Desoldering Reflow Degumming Layering Lamination Tin Planting Welding Mobile
Phone Curve Heating Tool.

Features:
1. Intelligent Desoldering, Reflow, Degumming, Layering, Lamination, Tin
Planting, Welding Mobile Phone Curve Heating Tool.
1. 3.4inch Screen Display Monitor temperature changes and realize reflow
soldering temperature curve data monitoring.
2. Turbofan blades for heat dissipation, built-in strong wind cooling system.
3. Adopted new MCH ceramic double heating element is adopted, the platform
has faster heating, more uniform temperature, and stable performance.
4. 5 professional mode selection, 3 common mode operation.

Description:
1. Reflow Soldering Preheating Platform is designed for the original solder
of mobile phone motherboard, curve heating, intelligent and safe desoldering
and reflow.
2. 5 application scene modes: degumming, layering, lamination, tin planting,
and welding.
3. 3 commonly used memory temperatures, automatic recording of the current
temperature and manual recording of the current temperature mode.
4. Suits for: Phone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro
Max/13 Mini/13/13 Pro/13Pro Max

Minimum Order: 1 pieces

Click to Enlarge