LED Encapsulation Materials for General Lighting

Good adhesion to metals, chips and other substrates
Good sulfur resistance and thermal shock performance
Translucent appearance
Applications
● Encapsulation for LED lighting components
● Encapsulation for LED backlight components
● Encapsulation for Auto LED lighting components
It is a kind of two-part, high temperature cure silicone resin, which is
designed for SMD LED encapsulation and suitable for protection of chips and
gold wire. The typical features are translucent appearance, good light
transmission, sulfur resistance, excellent thermal shock performance, and good
adhesion to frame and silver-plated coatings.
Specifications
Properties 8103 8105 7097S 8232 7098 8225 8136 8228
5004 5005S 8157 7136
Mix ratio 1:10 1:10 1:10 1:10 1:10 1:10 1:10 1:10
1:4 1:4 1:1 1:10
Viscosity 5200 4000 4600 4000 5300 3500 4300 4500
4000 4200 3600 4000
Refractive Index 1.55 1.54 1.55 1.54 1.54 1.52 1.54
1.50 1.54 1.54 1.41 1.41
Cure Condition 100℃*1hr, 150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr,
150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr,
150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr,
150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr, 150℃*3hr 100℃*1hr,
150℃*3hr
Shore Hardness D74 D62 D66 D62 D62 D65 D49 D45
A78 A75 A70 A55
Tensile Strength Mpa 12.5 11.0 7.0 11.0 6.5 7.0 3.0
3.0 2.0 2.5 6.5

Click to Enlarge