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Contact: Lyn Gui
Company: Goldlink Tongda Electroncis Co., Ltd
Rm619,Huafengxin'an building, Baoan
Shenzhen 518101
China
Phone: 86-755-27579310
Fax: 86-755-27579350
E-Mail: Send Inquiry Member for over 2 years
Date/Time:  4/20/21 8:19 GMT
 

High Deflection Thermal Gap Pad For Low Stress Electronics Applications

GLPOLY High Deflection Thermal Gap Pad Performs As Excellent As Laird Tflex HD80000 Does, Looks Second To None
GLPOLY XK-P60-Putty substitutes for Laird Tflex HD80000 with high performance and great compression.

Variety of thermal gap pad have been manufactured every day, only GLPOLY XK-P60-Putty can substitute for Laird Tflex HD80000 in China.
We heard that many suppliers said they can offer alternative to Laird Tflex HD80000 with one or two similar parameter(s), this is misleading. We can not judge its quality by one of the parameters, but a comprehensive performance. Some suppliers offer a so-called qualified part to customers, but they failed the test, that’s why many customers don’t trust local brands and wish to choose Bergquist, Laird or Fujipoly.

Last week, one customer asked if we can offer an alternative to Laird Tflex HD80000. This product provides a high performance with a thermal conductivity of 6.0W/mK and hardness of Shore00 40. Actually, it is not too hard to achieve these two parameters individually. So do you think it’s easy to produce such a thermal pad?

Actually, it’s not easy. Because you need to have thermal pad meet the two parameters at the same time. As we know, if we make the thermal conductivity higher, we need to fill much more thermally conductive powder, as a result, the hardness increased. That’s contradictory, the value of thermal conductivity is in direct proportion to that of hardness. We need to reverse this, that’s the point. Now GLPOLY XK-P60-Putty is the only that can substitute for Laird Tflex HD80000 with thermal conductivity of 6.0W/mK and hardness of Shore00 40.

Raw material of XK-P60-Putty is imported from Germany, and which will be secondary processed in GLPOLY by nano grinder. Particle size will be decreased, making filling and contact better, optimizing heat transfer. At the meantime, less volume of filler will be used achieving lightweight for finished product.

Low hardness provides higher compression and low strain, that optimizes interface contact. High deflection will decrease strain avoiding possibility of destroying PCB.

GLPOLY XK-P60-Putty has been used in military equipment in 2019 National Parade, and we are a qualified supplier to Huawei, ZTE and DJI. GLPOLY thermal materials help you design breakthroughs.

Minimum Order: 10 pieces

High Deflection Thermal Gap Pad For Low Stress Electronics Applications
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