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Contact: Lyn Gui
Company: Goldlink Tongda Electroncis Co., Ltd
Rm619,Huafengxin'an building, Baoan
Shenzhen 518101
China
Phone: 86-755-27579310
Fax: 86-755-27579350
E-Mail: Send Inquiry Member for over 2 years
Date/Time:  1/19/21 8:16 GMT
 

GLPOLY Thermally Conductive Structural Adhesive For EV Battery Cell Bond

GLPOLY thermally conductive ahesive that designed for power battery pack provided super advantages, such as strong bonding strength, long service life etc. the features of 8MPa bonding strength and 25-year service life are far beyond polyurethane based thermally conductive adhesive, attracting lots of engineers’ attention.

GLPOLY thermally conductive epoxy adhesives provide features and advantages:
1) Thermal conductivity 0.8~13.0W/mK;
2) 25-year service life at least, accelerated high temperature aging test verified;
3) 8MPa bonding strength for CTP battery, or customized as customers’ requirement

GLPOLY thermally conductive adhesives combine functions of thermally conductive, electrically insulation, bonding and sealing, simplifying assembly structure, reducing components and cost, decreasing mass of battery pack thus improving efficiency.

This material is suitable for different interface bond between metal and plastic.
1) Eliminates the need of mechanical fasten, simplifying structure, decreasing nmber of component required;
2) UL94 V-0 Equivalent;
3) Application temperature: -45~175℃, short term: 250℃;
4) Dielectric strength≥10kV/mm;
5) Compatible with automated dispense process

Cure schedule is customized according to customers’ process schedule, providing super flexibility for backflow process. GLPOLY thermally conductive adhesives have been applying to automotive electronics and EV battery pack, especially for battery cell bond.
GLPOLY has partnered with dJI, LG, DT Mobile, NIO Automotive and Leap Motor etc., providing them with superior thermal interface materials to keep devices run cooler and reliably.

Minimum Order: 10 pieces

GLPOLY Thermally Conductive Structural Adhesive For EV Battery Cell Bond
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