electron beam evaporation coating equipment for flexible substrate

The equipment uses electron beam evaporation as coating equipment. It is mainly
used to prepare various conductive thin films, semiconductor thin films,
ferroelectric thin films, optical thin films, micro-fabrication of micro and nano
devices, sample pretreatment of electron microscopy, etc. It is especially suitable
for evaporating various refractory metal materials. It can be used not only on hard
substrates such as glass and silicon wafers, but also on flexible substrates such
as PDMS, PTFE and PI.

Technical parameters of equipment
Conditions of use ambient temperature 5 ~40 C
Power supply three-phase 380 V
Power <20 KW
Water pressure <2.5bar
Vacuum chamber size evaporation chamber size: Phi 500 *H500
Electronic gun a new type of electronic gun, 6-hole crucible
Sample turntable Sample size: <150mm, sample can be rotated, and the
distance between sample and electron gun can be adjusted up and down (Sample holder
shape is designed according to user's requirements), heating temperature <500 C.
System Vacuum Limit vacuum: baked for 12 to 24 hours, continuously pumped less
than 5x10-5Pa
Pumping Rate: Vacuum < 5x10-4Pa within 40 minutes from atmospheric start
System Leakage Rate: Measuring Vacuum Vacuum Degree of Vacuum Chamber < 10Pa after
12 hours of shutdown
Vacuum pumping system FB1200 molecular pump + mechanical pump (TRP-36) system
with bypass pumping
Coating monitoring SQM160 film thickness meter is used for monitoring.
Coating thickness The unevenness of coating thickness is less than 6%

Minimum Order: 1 sets

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