Diamond CopperAluminum Series

Diamond Copper/Aluminum Series
Diamond copper is a composite material made of diamond powder and a copper
alloy. It utilizes high-quality artificial synthetic diamond powder, which
boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal
expansion coefficient. Through the appropriate process, the diamond particles
and the copper alloy create a metallurgical bonding interface, resulting in
the diamond copper composite material possessing outstanding thermal
conductivity and a suitable thermal expansion coefficient.

Diamond aluminum, similar to diamond copper, has a lower density, but its
thermal conductivity is slightly inferior to that of diamond copper.

Diamond copper and diamond aluminum are currently the best heat dissipation
materials in our company. Single crystal diamond and CVD diamond exhibit high
thermal conductivity, but their thermal expansion coefficient is too small.
On the other hand, carbon fiber composite materials offer directional thermal
expansion and thermal conductivity.

Minimum Order: 10 pieces