Copper Target

Copper target is a high-purity and highly conductive material utilized in various
applications such as semiconductor production, solar cell manufacturing, and
research applications such as X-ray fluorescence analysis. The copper targets are
available in various shapes and sizes and are designed with high precision to meet
the industry standards. The copper targets feature exceptional durability,
excellent thermal conductivity, and resistance to corrosion and oxidation, making
them a reliable material.

Classification Of Copper Target
Copper targets are classified based on the manufacturing process, purity level,
and the shape and size of the final product. Based on the manufacturing process,
the copper targets are divided into two categories - sputtering targets and
electroplating targets. Sputtering targets are manufactured using high-temperature
techniques, whereas electroplating targets are made through electrochemical
processes.

Purity level also plays a significant role in copper target classification, with
high-purity copper targets typically featuring purity levels greater than 99.99%.
Depending on the shape and size requirement, copper targets can be classified into
various shapes such as plates, disks, squares, and rectangles, or custom shapes as
per the specific application needs.

Operating Principle of Copper Target
Copper targets are primarily used in sputtering and electroplating applications,
where high-purity copper films are required. In the sputtering process, a high-
energy ion beam hits the surface of the copper target, causing it to eject copper
atoms. These atoms then deposit onto a substrate, forming a thin film.

The sputtering process operates based on the ionization of the sputtering gas,
typically argon, which creates a plasma that is accelerated towards the target
surface. The plasma ionizes the gaseous argon, creating high-energy ions that
impact the copper target, causing sputtering. The sputtered material is deposited
onto a substrate, creating a uniform and high-purity copper film.

In the electroplating process, a copper target is used as the anode, and a
substrate is used as the cathode. Direct current is passed through a copper
sulfate solution to deposit copper onto the substrate. During this process, copper
ions dissolve off the target, migrate to the cathode, and deposit onto the
substrate, forming a thin copper film.

Overall, the efficient operation of both sputtering and electroplating processes
is highly dependent on the purity and quality of the copper target material.

Physical Properties Of Copper Target
Density 8.92 g/cm3
Color Purplish red
Melting point 1083.4℃
Boiling point 2567℃

The copper target is appropriate for various sputtering techniques, such as two-
pole sputtering, three-pole sputtering, four-pole sputtering, RF sputtering, ion
beam sputtering, magnetron sputtering, and facing targets sputtering. It is
suitable for the deposition of several types of films, such as reflective,
conductive, semiconductor, decorative, protective, and integrated circuit films,
commonly used in applications including displays.

Compared to other target materials, copper targets are cost-effective, making them
the preferred choice when the desired film functionalities can be achieved.

If you want to know more about copper target price, please contact us.

More applications of cooling system in industry, please visit our website.

Minimum Order: 1 metres

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