CMP Polishing Slurry FInal Polishing Liquid

GRISH CMP slurry takes colloidal silica as base with unique formula design
according to different polishing requirements. Stable pH value keeps polishing rate
stable and saves polishing time. It can be widely used in the chemical mechanical
polishing for various materials, such as sapphire, semiconductor materials (ex. Si,
Ge, GaAs, InP, SiC, GaN, AlN), stainless steel, aluminum magnesium alloy and
compound crystal etc.

Applications:Silicon carbide substrate, Sapphire · LED material, Stainless steel,
Optical glass & crystal, Aluminum nitride heat sink substrate, Optical
communication

Features:
1. Uniform spherical SiO2 particles.
2. High removal rate and stable polishing performance.
3. Precision polishing quality with Ra<0.2nm and TTV<0.3um.
4. Cycle use for several times.
5. Applicable to low-temperature polishing process (Under 35℃).
6. Neutral or weak acid polishing slurry is available.

Minimum Order: 1 pieces

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