BGA Solder Ball

BGA Solder Ball
Product: Solder Ball
Product composition: tin 99.3 copper 0.7
Product size: 13mm 19mm 22mm
customizable
Product weight: can be customized
Solder balls are electrically conductive by using a heating tool to firmly bond
two or more metal conductors. Solder balls are a kind of product in solder.
Solder balls can be divided into lead solder balls and lead-free solder balls,
both of which are used for circuit board soldering. Made of high-purity pure
tin, its wettability and fluidity are very good, and it is simple and easy to
apply tin. The welded points are bright and full, and there will be no bad
virtual welding phenomenon. Adding appropriate antioxidant elements, the
antioxidant capacity is greatly improved. Solder balls are mostly used in the
processing and production of circuit boards. However, the commonly used solder
balls are not uniform in the fusion process of flux and metal, which easily
causes metal solution to splash, resulting in short circuit of products, and
has a bad impact on the stability of product quality. https://www.star-
sn.com/product/bga_solder_bal , ls

Minimum Order: 1 short tons

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