automatic ultrasonic assisted atmosphere heating spin coater

CY-SPC-HUA6 is a small and flexible spin coater, which can spray the glue on the
substrate through the ultrasonic nozzle, and then evenly apply the glue on the
substrate through high-speed rotation. It is also possible to directly perform the
spin coating operation alone.

Features
1.The chamber is equipped with heating elements, which can be baked after spinning
coating
2.The product has a gas path controlled by a 2-way float flowmeter, which can pass
inert gas into the chamber to protect the glue liquid from the gas in the air when
spinning coating
3.This machine is suitable for surface coating of semiconductor wafer, slide,
wafer, substrate, ITO conductive glass and other processes and plate making.
4.The maximum size of the crystallizable wafer is 6 inches, the rotational speed
can reach 10000rpm, and the acceleration can reach 5000rpm;
5.It has the advantages of stable speed, quick start, convenient operation, etc.,
and can ensure the consistency and uniformity of the thickness of spinning coating.

Minimum Order: 1 sets

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