ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine

Infinite Automation is the best choice if you are looking for dependable
Factory Automation Machines and Production Equipment. Among Our offered
machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding,
Die Bonder and Flip Chip Bonder Machines. Infinite Automation has a big
quantity of stock for Semiconductor related equipment. Among our featured
machines are original and used ASM NANO Die Bonder and Flip Chip Bonder.

Infinite Automation has more than 200 hundred units of Die Bonding and Die
Attach, and Wire Bonding machines available. Infinite Automation is a trusted
China supplier of best-conditioned pre-owned factory automation machines and
production line equipment. Contact our Sales and Customer Support Team for
inquiries.


ASM NANO Die Bonder and Flip Chip Bonder

Dimensions

W x D x H

1690 x 1430 x 2040 mm



The NANO Die Bonder / Flip Chip Bonder has a wide range of features including
the following:
Supports ± 0.3µm @ 3s placement accuracy
Supports all Die Attach and Flip Chip applications
High precision alignment optics
Vibration Damping System
Automatic Placement Offset Tuning System
High resolution 300mm Bonding Station
Dynamic Alignment System
Quantitative Parallelism Calibration
In-situ Eutectic Bonding Capability
3x Different Heated Options incl. Laser Soldering System
Epoxy Stamping and Dispensing capability
UV Curing capability at the Bond Station
Post-bond Inspection and Wafer Mapping Software
Clean Room Inside with HEPA Filter and Ionizer
Modular Machine Concept

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