Advanced Copper Heat Sink Design for High-Power Devices

Heat sink Features
1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away
from critical components to maintain optimal operating temperatures.
2.Various Fin Designs: Available in different fin shapes and configurations
to enhance airflow and heat transfer efficiency.
3.Material Options: Typically made from aluminum or copper, with each
material offering specific thermal and weight characteristics.
4.Customizable Sizes: Comes in various sizes and forms to fit different
devices and applications, from small electronics to large industrial systems.
5.Thermal Performance: Engineered to provide optimal thermal resistance and
conductivity, ensuring effective cooling.
6.Ease of Installation: Designed for straightforward mounting and integration
with other cooling systems or directly onto components.

Minimum Order: 10 pieces

Click to Enlarge