3-target DC magnetron sputtering device for metal film research

Magnetron sputtering is a kind of Physical Vapor Deposition (PVD).General
sputtering method can be used to prepare metal, semiconductor, insulator and other
materials, and has the advantages of simple equipment, easy control, large coating
area and strong adhesion
DC magnetron sputtering device can be used for preparing single-layer or multi-
layer ferroelectric thin films, conductive films, alloy films, and the like.
Compared with similar equipment, this three targets magnetron sputtering coater is
not only widely used, but also has the advantages of small size and easy operation,
and is an ideal equipment for preparing material films in a laboratory.

Technical parameters
1.Sample stage
Size:φ185mm
Temperature control accuracy:±1℃
Heating temperature:Max 500℃
Rotate speed:1-20rpm adjustable

2.Magnetron Sputtering target head
Quantity:2”×3 (1”,2” optional)
Water chiller:Circulating water chiller with flow rate of 10L/min

3.Vacuum chamber
Chamber size:φ300mm×300mm
Watch window:φ100mm
Chamber material:Stainless steel
Opening mode:Top cover open

4.Mass flowmeter
2 channels; measuring   range 100sccm; 100sccm (can be customized according to
customer needs)

5.Vacuum system Model:CY-GZK103-A
Pumping interface:KF40
Molecular pump:CY-600
Exhaust interface:KF16
Backing pump:rotary vane pump
Vacuum measurement:Compound vacuum gauge
Ultimate vacuum:1.0E-5Pa
Power supply:AC;220V 50/60Hz
Pumping rate:Molecular pump:   600L/S  rotary vane pump: 1.1L/S  
Comprehensive gas pumping performance: vacuum up to 1.0E-3Pa in 20 minutes

6.Power configuration DC power supply×3;Max output power:DC 500 W

7.Other parameters Supply voltage:AC220V,50Hz
Overall size:600mm×650mm×1280mm
Total power:3KW
Total Weight:300kg

Minimum Order: 1 sets

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